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Unique capabilities: Page 3 of 4

Process Hierarchy

  • Bonding
  • Clean
  • Consulting
  • Deposition
  • Doping
  • Etch
  • LIGA
  • Lift off
  • Lithography
  • Mask making
  • Metrology
  • Miscellaneous
  • Packaging
  • Polishing
  • Process technologies
  • Thermal
  • Unique capabilities
  • DUV Lithography
  • Deep boron diffusion
  • Hot Embossing
  • LIGA
  • Maskless lithography
  • Microwave bonding
  • Shape memory alloy deposition
  • Silicon-germanium processes
  • Supercritical dry
  • Xenon difluoride etch
per page
Process
Titanium/nickel DC-magnetron sputter
Silicon oxide dry etch
Aluminum microwave bonding
Copper microwave bonding
Gold microwave bonding
Nickel microwave bonding
Hot Embossing
Advanced Oxide Etch (STS-AOE)
Hot Embossing
Supercritical CO2 Dry
Aluminum Nitride AC magnetron reactive sputtering
MVD of Anti-Stiction Coating (DDMS)
MVD of Anti-stiction coating (FOTS)
Xenon difluoride (XeF2) Isotropic Si etch
Advanced oxide etch
Deep oxide etch - High aspect ratio
Deep oxide etch - Microlens recipe
Deep oxide etch - Standard recipe
Deep oxide etch - Ultra smooth sidewall
Supercritical CO2 Dry
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