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MNX

Unique capabilities: Page 2 of 4

Process Hierarchy

  • Bonding
  • Clean
  • Consulting
  • Deposition
  • Doping
  • Etch
  • LIGA
  • Lift off
  • Lithography
  • Mask making
  • Metrology
  • Miscellaneous
  • Packaging
  • Polishing
  • Process technologies
  • Thermal
  • Unique capabilities
  • DUV Lithography
  • Deep boron diffusion
  • Hot Embossing
  • LIGA
  • Maskless lithography
  • Microwave bonding
  • Shape memory alloy deposition
  • Silicon-germanium processes
  • Supercritical dry
  • Xenon difluoride etch
per page
Process
4X DUV photolithography
4X DUV photolithography (with BARC)
Deep boron diffusion (Double-sided)
Deep boron diffusion (Single sided)
P-type polygermanium LPCVD
Poly-Silicon-Germanium LPCVD
Undoped polygermanium LPCVD
Deep boron diffusion
Deep boron diffusion with drive-in
Phosphorus diffusion with drive-in
Plastic MEMS (PMEMS)
Silicon-On-Glass MEMS (SOG-MEMS)
Anti-stiction coating (Alkylhalosilanes)
Advanced oxide etch
Direct laser write
E-beam exposure (ebeam)
Maskless laser write
Resist UV Stabilization
Xenon difluoride (XeF2) Isotropic Si Etch (Xactix)
SiC RIE (AOE)
Results Page:  1 2 3 4
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