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MNX

Unique capabilities: Page 1 of 4

Process Hierarchy

  • Bonding
  • Clean
  • Consulting
  • Deposition
  • Doping
  • Etch
  • LIGA
  • Lift off
  • Lithography
  • Mask making
  • Metrology
  • Miscellaneous
  • Packaging
  • Polishing
  • Process technologies
  • Thermal
  • Unique capabilities
  • DUV Lithography
  • Deep boron diffusion
  • Hot Embossing
  • LIGA
  • Maskless lithography
  • Microwave bonding
  • Shape memory alloy deposition
  • Silicon-germanium processes
  • Supercritical dry
  • Xenon difluoride etch
per page
Process
Custom Laser write litho module
Direct laser write lithography (Automated)
Direct laser write lithography (Manual)
E-beam Lithography
PiezoMEMS - PZT based Actuator/Transducer module (Custom process)
PiezoMEMS - PZT based Actuator/Transducer module (Multi-Project-Run)
PiezoMEMS Photonics Module
Nickel LIGA (fully anchored structures) (PMMA)
Nickel LIGA (fully released structures) (PMMA)
Nickel LIGA (suspended structures) (PMMA)
Application Specific Integrated MEMS Exchange (ASIM-X)
Titanium/nickel DC-magnetron sputtering
Maskless photolithography (align/expose only)
Maskless photolithography (front-front align) (Rogers R/Flex 8080)
Maskless photolithography (front-front align) (Shipley 1827)
Maskless photolithography (front-front align) (Shipley 220)
Nanogetter packaging
Nickel LIGA (fully anchored structures) (Type 1 mold insert)
Nickel LIGA (fully anchored structures) (Type 2 mold insert)
aMEMS
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