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Miscellaneous deposition: Page 1 of 3

Process Hierarchy

  • Bonding
  • Clean
  • Consulting
  • Deposition
  • Evaporation
  • LPCVD
  • Low-stress SiN deposition
  • Miscellaneous deposition
  • Oxidation
  • PECVD
  • Spin casting
  • Sputtering
  • Doping
  • Etch
  • LIGA
  • Lift off
  • Lithography
  • Mask making
  • Metrology
  • Miscellaneous
  • Packaging
  • Polishing
  • Process technologies
  • Thermal
  • Unique capabilities
per page
Process
Development #1 - LaNiO3 (LNO) Deposition
Development #2 - PZT on LaNiO3 (LNO)
PZT Development module
PZT on LaNiO3 (LNO) Deposition
PiezoMEMS - PZT based Actuator/Transducer module (Custom process)
PiezoMEMS - PZT based Actuator/Transducer module (Multi-Project-Run)
PiezoMEMS Photonics Module
Platinized silicon wafer (SiO2/TiOx/Pt)
Polyimide deposition and curing (Durimide)
Polyimide deposition, patterning and curing (Durimide 7520)
Parylene C deposition
Parylene N deposition
Parylene C deposition
Anti-stiction coating (Alkylhalosilanes)
ALD
Cool grease bonding
Photoresist Spray Coat
Spin casting (Durimide 7520)
Spin casting (Durimide)
Spin casting Programmable Spinner
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