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Advantages
Capabilities
Company
How to Start
About MEMS
Metrology: Page 5 of 6
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Mask making
Metrology
Electrical metrology
Geometric metrology
Miscellaneous metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
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Process
Cleanliness measurement
Contact sheet resistance measurement
Current-Voltage measurement
EDX (Energy Dispersive Spectrometry)
ESCA (Electron Spectroscopy for Chemical Analysis)
FTIR (Fourier Transform Infrared Spectroscopy)
Film thickness measurement
Film thickness measurement (ellipsometry)
Film thickness measurement (interferometry)
GC (Gas Chromatography) mass spectroscopy
Line width measurement
Metrology
Non-contact profilometry
Non-contact sheet resistance measurement
Optical microscopy
Particle count
Residual stress measurement
SEM (Scanning Electron Microscopy)
SIMS (Secondary Ion Mass Spectrometry)
STM (Scanning Tunneling Microscopy)
Results Page:
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