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MNX

Deposition: Page 10 of 17

Process Hierarchy

  • Bonding
  • Clean
  • Consulting
  • Deposition
  • Evaporation
  • LPCVD
  • Low-stress SiN deposition
  • Miscellaneous deposition
  • Oxidation
  • PECVD
  • Spin casting
  • Sputtering
  • Doping
  • Etch
  • LIGA
  • Lift off
  • Lithography
  • Mask making
  • Metrology
  • Miscellaneous
  • Packaging
  • Polishing
  • Process technologies
  • Thermal
  • Unique capabilities
per page
Process
PTFE Deposition
Dry oxidation
E-beam metal evaporation (Temescal)
Low Stress silicon nitride LPCVD (300 MPa)
Metal sputter deposition (Veeco)
Reactive Evaporation - Optical film coating (Leybold APS 1104)
Silicon Nitride PECVD (STS)
Silicon dioxide PECVD (STS)
Stoichiometric silicon nitride LPCVD
TEOS LPCVD
TEOS PECVD (STS)
Undoped polysilicon LPCVD
Wet oxidation
E-beam Evaporation (Au)
E-beam Evaporation (Cr)
E-beam Evaporation (Pt)
E-beam Evaporation (Ti)
Aluminum DC-magnetron sputtering
Silicon dioxide PECVD (TEOS)
Silicon nitride PECVD
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