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Deposition: Page 9 of 17

Process Hierarchy

  • Bonding
  • Clean
  • Consulting
  • Deposition
  • Evaporation
  • LPCVD
  • Low-stress SiN deposition
  • Miscellaneous deposition
  • Oxidation
  • PECVD
  • Spin casting
  • Sputtering
  • Doping
  • Etch
  • LIGA
  • Lift off
  • Lithography
  • Mask making
  • Metrology
  • Miscellaneous
  • Packaging
  • Polishing
  • Process technologies
  • Thermal
  • Unique capabilities
per page
Process
Dry/wet/dry oxidation
Indium Tin Oxide (ITO) DC-magnetron sputtering
Nichrome DC-magnetron sputtering (high power)
Nichrome DC-magnetron sputtering (low power)
Nickel DC-magnetron sputtering (high power)
Nickel DC-magnetron sputtering (low power)
PSG LPCVD
Palladium DC-magnetron sputtering
Phosphorus-doped polysilicon LPCVD
Platinum DC-magnetron sputtering (high power)
Platinum DC-magnetron sputtering (low power)
Silicon dioxide PECVD (TEOS)
Silicon nitride LPCVD
Silicon nitride PECVD
Titanium DC-magnetron sputtering (high power)
Titanium DC-magnetron sputtering (low power)
Titanium/nickel DC-magnetron sputter
Tungsten DC-magnetron sputtering (high power)
Tungsten DC-magnetron sputtering (low power)
Undoped polysilicon LPCVD
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