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Anisotropic etch: Page 4 of 5

Process Hierarchy

  • Bonding
  • Clean
  • Consulting
  • Deposition
  • Doping
  • Etch
  • Anisotropic etch
  • Deep RIE
  • Isotropic etch
  • Miscellaneous etch
  • Strip
  • LIGA
  • Lift off
  • Lithography
  • Mask making
  • Metrology
  • Miscellaneous
  • Packaging
  • Polishing
  • Process technologies
  • Thermal
  • Unique capabilities
Anisotropic etch
Wet and dry etch processes in which the undercutting is different from (in most case less than) the depth of the etch.
per page
Process
KOH Silicon Etch II
KOH Silicon Etch II (Single side etching)
Silicon DRIE (Bosch Process)
Silicon dioxide dry etch
Deep RIE (Bosch process)
Polysilicon plasma etch (anisotropic, MOS clean)
Polysilicon plasma etch (gold contaminated)
Silicon dioxide plasma etch (anisotropic, MOS clean)
Silicon nitride plasma etch
Silicon nitride plasma etch (gold contaminated)
Silicon wet etch (KOH)
Silicon DRIE
Silicon DRIE II
KOH etch
Poly-Ge RIE
Poly-SiGe RIE
Silicon DRIE with anti-footing SOI option
TMAH silicon etch
Advanced oxide etch
Deep oxide etch - High aspect ratio
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