Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
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  Spectrophotometric film thickness measurement
Batch size 1
Materials polysilicon, polysilicon (phosphorus doped), silicon nitride, silicon dioxide, phosphosilicate glass, zinc oxide
Measurement aspect thickness
Measurement unit Ang
Refractive index 1 .. 4
Setup time 30 min
Sides inspected
The sides of the wafer inspected by the process
 either
Thickness 0 .. 50 µm
Wafer size
Wafer size
Equipment NanoSpec Spectrophotometer
Equipment characteristics:
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat
Wafer holder
Device that holds the wafers during processing.
 recessed platen
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
 300 .. 700 µm
Comments:
  • Film thickness measured at five locations per wafer; normally two test wafers used.